The European project ORIONAS (Lasercom-on-chip for next generation, high-speed satellite constellation interconnectivity) was launched on 1st November 2018 with the kick-off meeting held in Toulouse, France on 19th November 2018. The duration of the project is 3 years.
ORIONAS is focusing on the development of electronic-photonic integrated circuits (ePICs) for next generation, high speed inter-satellite laser communications.
ORIONAS aims to disrupt the way lasercom modems are designed, built and qualified in order to enable low C-SWAP satellite constellation lasercom links. ORIONAS will squeeze the current bulk lasercom modems into monolithic InP and BICMOS ePICs using cost-effective multi-project wafer run (MPW) fabrication within European foundries. ORIONAS will package the ePICs using hi-rel module assembly processes and will develop a 50 Gb/s laser-mini-modem suitable for a new-gen low C-SWAP lasercom terminals.