The ORIONAS technical targets from component to system are:
  1. Development of a High performance BICMOS Front-End-of-Line (FEOL) integration platform for cost effective Multi Project Wafer (MPW) fabrication of space transceiver ePICs within a European foundry
  2. Fabrication of silicon modulator monolithically integrated with its driver IC and silicon receiver circuit integrating the optical demodulator, balanced detectors and TIA ICs.
  3. Fabrication of hermetic lasercom transceiver modules delivering >50 Gb/s aggregate bit rate, i.e. 20 times faster than current state-of-the-art lasercom terminals. These devices will represent a 16x times size reduction with respect to the current state-of-the-art pulsed laser transmitter for small satellite platforms built with discrete components
  4. Cost-effective MPW fabrication of >1W HP-SOA through monolithic integration within a European III-V foundry
  5.  Fabrication and packaging of HP-SOA demonstrating 2 orders of magnitude smaller footprint than current space HP-OFA and >10x times more powerful than current commercial SOAs.
  6. Fabrication of compact, rad-hard-by-design fiber pre-amplifier array module using low-cost COTS Erbium doped fibers
  7.  System integration of the miniaturized transceiver and HP-SOA modules in a compact and fully functional lasercom-mini-modem (LMM) platform and functional validation through system trials conducted by Thales Alenia Space


ORIONAS follows a bottom-up evolution in this 3-year development plan to deliver electronic-photonic engines, transceiver & amplifier modules and finally lasercom sub-systems that will hit the right C-SWAP targets of future satellite constellation lasercom systems.

Close Menu