ORIONAS is a targeted research project with the specific, well-defined technical objective of developing a new family of electro-photonic devices to address the current and future requirements of high-speed inter-satellite links and enable the business case of new generation satellite constellations. The project consortium has been selected so as to include the entire technology development chain, starting from the core technology developers and extending to the component and system levels

LÈΩ Space Photonics R&D

LÈΩ Space Photonics R&D is co-ordinating ORIONAS. LÈΩ is also responsibe for the physical layer simulations that link the application layer with the technology layer. LÈΩ contributes to the device design and the theoretical performance evaluation in the lasercom link configurations defined with TAS. LÈΩ brings in their expertise in space-grade fiber amplifier development to contribute in the design and modeling of the ORIONAS pre-amplified receiver sub-system.

Thales Alenia Space

Thales Alenia Space drives the application and system aspects. TAS participates with two groups: TAS-France (Toulouse) responsible for the system-level design and evaluation & TAS-Switzerland bringing unique expertise in the design and development of commercial lasercom terminals for small satellite platforms. TAS will be responsible for the project business planning and exploitation roadmap.

Innovations for High Performance Microelectronics

IHP is the BiCMOS foundry that brings in the expertise in SiGe BiCMOS as well as silicon photonics technologies. IHP is responsible for the design of the electronic-photonic transceiver engines as well as their manufacturing through its Multi-Project Wafer (MPW) run service. IHP provides the front-end-of-line integration platform for the monolithic integration of BiCMOS electronic circuits with silicon photonic devices and their manufacturing through the 250 nm SiGe BiCMOS process 

Gooch & Housego

G&H brings in their rich heritage in manufacturing hi-rel fiber optic components and systems for space applications. G&H is responsible for the assembly, integration & testing of the radiation-hard pre-amplifier unit as well as the assembly & integration of the ORIONAS lasercom mini-modem. 


III-V LAB acts as the InP foundry bringing a rich expertise in the development of high-performance III-V devices spanning from structure design though epitaxial growth and up to manufacturing through an MPW process. III-V LAB is responsible for the design and fabrication of the high-power Semiconductor Optical Amplifier chips exploiting their know-how in developing diverse SOA devices for telecommunication and RoF systems. 


LUSOSPACE bring their expertise in the assembly and integration of flight-grade lasercom transmitter units that include high power externally modulated lasers and high performance FPGAs. LUSOPACE is responsible for the system integration of the ORIONAS devices with their control electronics including FPGA, ADC/DAC and laser driver electronics.

CNIT - National Inter-University Consortium for Telecommunications

CNIT brings in its experience and infrastructure in module packaging/pigtailing of photonic integrated circuits. CNIT is responsible for the optical sub-assembly design of the ORIONAS high-speed transmitter modules and the definition of the TOSA assembly / integration process.


OPTOCAP performs the module packaging of the ORIONAS transceiver and semiconductor optical amplifier integrated circuits. OPTOCAP will leverage its experience in packaging micro-electronic and opto-electronic circuits and will apply laser welding assembly of the photonic IC and fibers to deliver hi-rel and hermetically sealed photonic modules.   

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